WEICON Easy-Mix S 50 – High-Temperature Epoxy Adhesive (50 ml Two-Component)

$39.90
Tax included. Shipping calculated at checkout.

Weicon (Germany)

WEICON-10005230

Pickup available at 1092 Lower Delta Road

Usually ready in 4 hours

Shipping & Delivery

For orders within Singapore

Up to $180: $25
Above $180: Free Delivery

Delivery to restricted areas have additional charges.

For orders outside Singapore

We can arrange a forwarder pickup for your goods. Taxes, duties and other expenses paid during transport is borne by the customer. Contact us for special shipping and delivery arrangements.


WEICON Easy-Mix S 50 is a two-component, fast-curing epoxy adhesive engineered for quick repairs, maintenance, and industrial production runs. Supplied in a dual-cartridge system with static mixer, it enables precise 1 : 1 mixing and immediate application without measuring. The adhesive is viscous yet self-levelling, bonds strongly to a wide variety of substrates — including metal, plastic, wood, glass, stone, ceramics, fiber composites — and fills small gaps up to 2 mm. It boasts very short pot life (about 4–5 minutes at 20 °C) and cures rapidly: handling strength in ~15–30 min, workable strength ~20–60 min (depending on layer/humidity), and full cure in ~24 hours. Once cured, the bond exhibits high tensile and shear strength, good impact and shock resistance, and endures temperatures from –50 °C up to +180 °C (depending on use and variant). Ideal for structural bonding, repairs, maintenance, and industrial applications.

Frequently Asked Questions

WEICON Easy-Mix S 50 Epoxy Adhesive

What is WEICON Easy-Mix S 50 used for?

It is used for fast structural bonding, repairs, and maintenance across metal, plastic, wood, glass, and ceramics.

Why choose WEICON Easy-Mix S 50 epoxy adhesive?

The dual cartridge mixes accurately and cures quickly, reducing measuring errors and downtime.

Where is WEICON Easy-Mix S 50 useful?

It suits workshops, repair teams, production users, and maintenance departments needing fast epoxy bonding.